Yincae Announces SMT256 Solder Joint Encapsulant
Published: 11 April 2014
SMT256 Solder Joint Encapsulant replaces traditional underfill on printed circuit boards. Is said to create a bond stronger than using existing soldering/underfilling methods. Is for board- and package-level high-speed and high-durability applications.
Yincae Advanced Materials, www.yincae.com
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