Products
TSR benchtop robot series handles a range of fluid dispensing applications, from inline to batch. Comes in three models (TSR2201, TSR2301 and TSR2401) to accommodate a range of working envelopes. Easy-to-program, and features dedicated fluid dispensing software, eliminating the need for complex robot language programming. Fully integrated positioning and fluid dispensing functions. Compatible with all Techcon Systems syringes, valves and jet dispensers.
Techcon Systems, www.techconsystems.com
PCBVac shop vac for printed circuit board repair cleaning cleans liquids and solids from a PCB. Is adjustable and includes a handheld tool. Teflon heat-resistant nozzles clean molten solder; nozzles can be trimmed to size for different vacuum pressures. Can clean solidified solder fines, scraped off solder mask or coatings, unreacted flux, flux cleaners, solvents and other liquids. Has a controller with ON/OFF and vacuum adjustment, a disconnect plug, flex input tubing and filtration, a handheld vacuum applicator inclusive of six ft. of flex hose and five tips. Hand piece includes trap system.
BEST Inc., www.solder.net
Loctite Eccobond EN 3810T and Loctite Eccobond EN 3838T are encapsulant formulations that can be selectively applied to environmentally-susceptible components. Deliver a barrier that is reportedly impervious to moisture and fluids. Are ideal for handheld and automotive applications. Cure quickly at moderate temperature; are well-suited for high-volume manufacturing operations. 3810T is a non-flexible material and 3838T is a flexible, low Tg encapsulant.
Henkel, www.henkel.com/electronics
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