MC-301 benchtop reflow oven is for prototyping, manufacturability testing, and short-run batch production. Has an Android-based control app; permits surface mount assemblers and product developers to meet specifications for preheat, soak, reflow, and cooling phases. Heating and cooling rates in each stage are automatically calculated. Includes internal thermocouple to measure and record actual temperatures on the printed circuit board while soldering. Real-time feedback from the thermocouple can be used to control heater power and to establish temperature settings. Heating chamber is divided into multiple heating zones; each one is assigned to its own channel of the temperature control system. Ensures delta-T ±2 °C across 10" x 8" working area. Rapid cooldown is achieved with intake fans that draw air through the bottom of the unit and out through the 3" exhaust port. Measures 27" x 19" x 11" and weighs fewer than 100 lbs.

Manncorp, www.manncorp.com