Products
Hybrid pick-and-place machine is capable of 7µm placement accuracy. Placement head carries one component at a time. Provides low-force closed-loop placement. Reportedly has placement defect rate < 1 dpm. Places up to 121,000 passives per hr. and up to 27,000 flip chips per hr. Controllable placement Z-axis can adapt placement height search algorithms for different heights, optimizing placement force for 2.5D mounting, package on package or embedded passive and active devices.
Assembléon, www.assembleon.com
2005 Zebra Connector is constructed from alternating layers of conductive carbon and nonconductive silicone as thin as 0.0004". Permits 500 conductive layers per inch. Is used to connect LCD displays directly to a printed circuit board with contact spacing as close as 0.010". Offers a carrying capacity of 50 mA per 0.040" x 0.040" pad; comes in widths ranging from 0.015" to 0.118" and lengths up to 9".
Fujipoly America Corp., www.fujipoly.com
Solder Mask Check Wipes seek out under-cured and porous solder resist. Can help identify conductive residues from HASL fluids causing electromigration or poor SIR values. Provides immediate color observation after 10 to 15 sec. of wiping bare or populated printed circuit boards. Can be used to pre-wipe bare PCBs to remove bleed from solder resist onto surface mount pads.
BLT Circuit Services, www.bltcircuitservices.co.uk/Scripts/default.asp
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