caLogo

Hybrid pick-and-place machine is capable of 7µm placement accuracy. Placement head carries one component at a time. Provides low-force closed-loop placement. Reportedly has placement defect rate < 1 dpm. Places up to 121,000 passives per hr. and up to 27,000 flip chips per hr. Controllable placement Z-axis can adapt placement height search algorithms for different heights, optimizing placement force for 2.5D mounting, package on package or embedded passive and active devices.

Assembléon, www.assembleon.com

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account