Hybrid pick-and-place machine is capable of 7µm placement accuracy. Placement head carries one component at a time. Provides low-force closed-loop placement. Reportedly has placement defect rate < 1 dpm. Places up to 121,000 passives per hr. and up to 27,000 flip chips per hr. Controllable placement Z-axis can adapt placement height search algorithms for different heights, optimizing placement force for 2.5D mounting, package on package or embedded passive and active devices.

Assembléon, www.assembleon.com

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