RNV Series vacuum reflow oven is said to reduce solder joint voids when soldering larger PCBs and area-array packages through a combination of hot air reflow, nitrogen purge and heat circulation vacuum.  Features include ultra-low power consumption, an efficient and large capacity flux recovery system, soldering capability of heat sinks with metal substrates, and fast tact time. Uses reflow in combination with hydrogen/formic acid for a no-flux wash process, lowered influences on insulation resistance and ion migration, and void-free soldering. Comes in batch model, for prototype and lab applications, and inline systems for volume and higher temperature applications.

Eightech, www.eightech.com

Seika Machinery, www.seikausa.com

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