Products
ECM CA-175 snap cure conductive adhesive is designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules. Has a moderate glass transition temperature and modulus. Has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement; is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. Reportedly fully cures in 8 sec. at 200°C.
Engineered Materials Systems, www.emsadhesives.com
SC1 high-performance radial connectors come in single and paired row versions. Are part of the SCM family. Are for high current, high power applications (10A). Come in surface mount and through-hole designs. For battery charging, board-to-board connections, interposers and medical devices.
Everett Charles Technologies, www.ectinfo.com/compliantconnectors
5R7-570(A) RoHS-compliant open board electronic temperature controllers feature a proportional integral control algorithm for precise control of thermoelectric modules (Peltier). H-bridge temperature control is said to provide seamless transition between heating and cooling eliminating dead spots. Green LED for heat and blue LED for cooling indicate mode and simultaneous illumination indicates load circuit is off due to an open sensor. Pulse width modulation controls power level in thermoelectric module at a base frequency of 1Khz. Power resolution is one of ±250 steps in the load circuit control. Is 1.75" x 3.5" X 3" with input voltage of 6 to 28VDC, output voltage of 0 to 36VDC, load current of 0.1 to 12.5A, 450W output power control, control stability of ±0.1°C and temperature range of -20° to 150°C.
Oven Industries, www.ovenindustries.com
Press Releases
- Changes in Incap’s Management Team: Incap updates its leadership model to support its growth strategy
- Niche Electronics Celebrates Completion of Florida Expansion
- Microscreen Names Nik Thomas Director, Expands Leadership Role Amid Continued Organizational Growth
- W&S Enters New Growth Phase Through Strategic Partnership and New Leadership