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SN100C P506 D4 is a Pb-free, no-clean solder paste. Reportedly can be stored at room temperature for more than 60 days without deterioration. Has excellent consecutive printability.

Nihon Superior, www.nihonsuperior.co.jp/english

ECM CA-175 snap cure conductive adhesive is designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules. Has a moderate glass transition temperature and modulus. Has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement; is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. Reportedly fully cures in 8 sec. at 200°C.

Engineered Materials Systems, www.emsadhesives.com 

 

SC1 high-performance radial connectors come in single and paired row versions. Are part of the SCM family. Are for high current, high power applications (10A). Come in surface mount and through-hole designs. For battery charging, board-to-board connections, interposers and medical devices.

Everett Charles Technologies, www.ectinfo.com/compliantconnectors

 

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