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Spherolyte RDL / Pillar 2 process for high-speed plating of copper pillars and redistribution layers (RDLs) is a sulfuric acid-based three additive copper electrolyte system. Nonuniformity value – within wafer, die or/and profile – of the deposited copper structures, even over a range of applied current densities, is up to 17.5 ASD  (3.9 µm/min). Process control is analyzable through an online system for all additives. Is for flip-chip applications for various sizes of copper pillars (including µ-Pillars), especially for handhelds such as tablets or smartphones.

Atotech, atotech.com

Kapton SMT plastic film stencils reportedly permit clean and precise hole patterns. Come in 4, 5 and 6 mil thicknesses. Present flat coplanar printing surfaces for solder paste printing. Are designed for prototype assembly, and the pitch of the components is one or above. Absorb heat of laser-cutting process without producing ridges.

BEST Inc., www.solder.net

RX-6 high-speed compact modular mounter places components ranging from subminiature components to large ICs or odd-shaped parts. Is equipped with head units that pick components and place them on PWBs on both the rear and front sides; head units on the front and rear sides repeat picking up and placing components. IC component height and PWB size are increased; can support production such as mounting of LEDs or PoPs. Includes placement monitor analyze function.
RX-7 mounter places subminiature components on PWBs at high speed. Includes two super rotary heads equipped with 16 nozzles for picking up/placing each component on a PWB. Achieves 75,000 cph. Parallel head configuration is used for the heads. Camera inside head detects tombstoning or component absence.

Juki, www.jukiamericas.com

 

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