Products
585-1 nonconductive paste provides reliability to gold stud bump interconnects used in flip-chip packaging. Has high fracture toughness and adhesion. Is ionically clean and cures in seconds during thermal compression bonding at 200°C.
Engineered Material Systems, www.emsadhesives.com
PanelScan traceability and inspection system captures 1D and 2D barcode data from multi-array PCBs at the front-end or mid-stream on an SMT line. Is said to read barcodes on entire length and width of any PCB array. Intuitive user interface for quick training. Replaces manual scanning. Does not require line shutdowns to reposition, reconfigure, and test barcode readers. Comes in standard and wide configurations. Includes up to two GigE line scan cameras and lenses, up to two custom LED lights, software, trigger, and cables. Integrates into existing manufacturing execution system (MES) software.
Microscan, www.microscan.com
RP-1 solder paste printer has a special mechanism to align the bare PWB with a screen mask; drives three alignment modules attached on the outer circumference of the mask stage to adjust the position in X, Y and θ directions simultaneously. This permits repetitive printing accuracy of circumference fine adjustment to improve up to ±10μm, and duration including correction and movement time reduced to six sec. Optional automatic solder dispenser and cleaning functions available.
Juki, www.jukiamericas.com
Press Releases
- VJ Electronix Expands U.S. Coverage with MaRC Technologies Representation in the Pacific Northwest
- Absolute EMS Adopts Luminovo to Modernize and Streamline Quoting
- Iiris Heiskanen Appointed as New CFO of Scanfil
- CE3S Expands Electrostatic Measurement Offering with Next-Generation Compact Static Field Meter from Desco Industries