Products
BiAgX high-melt lead-free (Pb-free) solder paste is a drop-in replacement for standard high Pb-containing solder pastes. Is for small, low-voltage QFN packages used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. Is said to perform in at temperatures in excess of 150°C. Reportedly requires minimal process adjustments from standard high Pb-containing solder paste-based processes. Has passed MSL1 and thermal cycle testing at several power semiconductor customers. Is said to reflow, solder, wet and solidify like other solder pastes. Comes in dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
Indium, www.indium.com/BiAgX
EAC-7000 and ETF-700 systems are for hand assembly directly into a wave. EAC-7000 is a manual slide line system that offers a free rolling steel bearing system that permits printed circuit boards or pallets to glide from operator to operator. Is available in 15° and 0° rail sets. Includes ESD ground port, angled parts tray, overhead light and foot board. Has low-profile front fascia. Standard clip rail is included. When configured with ETF-700 (auto wave loader), operator can manually slide PCB or pallet to activate entrance sensor.
Promation, www.Pro-mation-Inc.com
585-1 nonconductive paste provides reliability to gold stud bump interconnects used in flip-chip packaging. Has high fracture toughness and adhesion. Is ionically clean and cures in seconds during thermal compression bonding at 200°C.
Engineered Material Systems, www.emsadhesives.com
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