Products
DF-2000 series dry film negative photoresists are for hot roll lamination and processing on MEMS and IC wafers. Were developed for consistent photo speeds with +/- 3% critical dimension target. Are available in thickness formats from 5 to 50µm, +/- 5%. Have a glass transition temp. of 145°C and a moderate modulus of 4.5 GPa at 25°C. Are hydrophobic and compatible with the EMS line of spin coatable photoresists.
Engineered Material Systems, www.emsadhesives.com
DF-2000 series dry film negative photoresists are for hot roll lamination and processing on MEMS and IC wafers. Were developed for consistent photo speeds with +/- 3% critical dimension target. Are available in thickness formats from 5 to 50µm, +/- 5%. Have a glass transition temp. of 145°C and a moderate modulus of 4.5 GPa at 25°C. Are hydrophobic and compatible with the EMS line of spin coatable photoresists.
Engineered Material Systems, www.emsadhesives.com
Micro Fine soldering iron tips are designed for soldering small components, even on dense boards. Tip sizes range from 0.1 to 1mm. Are available for EB9000S soldering station and EB2000S station; can be used with STTC/SMTC.
EasyBraid Co., www.easybraidco.com
Press Releases
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