topoView is part of XI-Pilot v. 3.1 x-ray inspection software for evaluation of x-ray images. Facilitates interpretation of x-ray images with respect to better fault assessment and classification. Construes every grey value of an x-ray image as a change in material thickness and density. Thick materials such as solder (dark grey values) are displayed on a higher position than less thick PCB materials (light grey values). Faults such as lifted leads, shorts, non-soldering, insufficient or too much solder are displayed.
Goepel electronic, www.goepel.com
Asscon VP1000 and VP6000 vapor phase reflow systems now come with Dynamic Profiling, which automatically adjusts and controls reflow profiles. Simplifies setup and preparation of reflow profiles; eliminates interferences due to different loads or usage conditions. User determines temperature profile and keys in values to the PLC user interface. Can create soldering program by determining start soak temperature (°C), duration ramp, and time above liquidus. Uses embedded three temp. reference measuring points for permanent control and monitoring of the profile. Controller can use temp. behavior of selected reference measuring points to start appropriate control actions during profiling.
Asscon Systemtechnik, www.asscon.de
X Series placement machines are up to 0.5 meters shorter than the previous models. X4i S places 120,000 components per hour (cph) in a footprint of 1.9 x 2.6 m. Come in three- (X3 S, shown below) and four-gantry (X4i S) models, with slots for up to 160 8mm feeders, conveyors for boards up to 650mm wide, barcode readers, adjustable pin support, interchangeable gantries and new tray feeders. Handle printed circuit boards up to 610 x 560mm. Dual-conveyor setup handles PCBs up to 450 x 300mm. Places components from 01005 to 200mm long.
Siplace, www.siplace.com
