Products
Cognex Industrial Camera (CIC) series are GigE Vision digital industrial cameras designed for integration with VisionPro and CVL vision software. First four models are 29mm x 29mm, monochrome, area scan cameras. VisionPro provides access to a library of computer vision tools, from geometric object location and inspection to identification and measurement algorithms.
Cognex, www.cognex.com/cic
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Is designed to eliminate warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and general bonding applications in photonics assembly. Reportedly cures rapidly when exposed to high-intensity UV light. Does not contain antimony.
Engineered Material Systems, www.emsadhesives.com
Sherlock 3.0 automated design analysis software is for analyzing, grading and certifying the expected reliability of products at the circuit card assembly level. Includes a global parts database with private cloud storage; 3D FEA model and 3D viewer for ICT and shock and vibration analysis; sub-assembly analysis to attach one or more printed circuit board subassemblies to the primary circuit board; improved result management functionality, and embedded failure rate models.
DfR Solutions, www.dfrsolutions.com
Press Releases
- Adam Ryder appointed as Managing Director of Incap UK
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- Matric Group Becomes the First U.S. Manufacturer to Deploy Panasonic NPM-GH Dual Lane SMT Technology