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Divisio 1000 Easy Duo is for low-stress, automatic PCB depaneling. Includes two loading drawers, linear motor gantries and a host of standard features including a camera system, fiducial recognition and camera assisted program generation.

ASYS Group, asys-group.com

HFFR hexane-free flux remover is a fast-drying cleaning solvent. Eliminates low levels of n-Hexane. Is available in 400ml aerosol form with a brush or in 5L bulk containers.

Electrolube, www.electrolube.com

DB-1568-1 low-temperature cure die attach adhesive is for attaching semiconductor die in temperature-sensitive devices. Applications include smart cards, camera modules, and flex circuits. Is more than 90% cured after 30 min. at 80°C; has a dispensing work life greater than 48 hrs (measured as a 25% increase in viscosity. Is reportedly ideal for flexible applications with high peel strength. Can be cured in 1 min. at 180°C.

Engineered Material Systems, www.conductives.com

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