DB-1568-1 low-temperature cure die attach adhesive is for attaching semiconductor die in temperature-sensitive devices. Applications include smart cards, camera modules, and flex circuits. Is more than 90% cured after 30 min. at 80°C; has a dispensing work life greater than 48 hrs (measured as a 25% increase in viscosity. Is reportedly ideal for flexible applications with high peel strength. Can be cured in 1 min. at 180°C.

Engineered Material Systems, www.conductives.com

• Prev
• Next