Products
Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow, and for the combined data set. Data to be analyzed can be collected with any TherMoiré system. Includes Pass/Warning/Fail maps, and graphical results identifying problem areas.
Akrometrix, www.akrometrix.com
Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow, and for the combined data set. Data to be analyzed can be collected with any TherMoiré system. Includes Pass/Warning/Fail maps, and graphical results identifying problem areas.
Akrometrix, www.akrometrix.com
MaxiReflow HP void-free soldering combines convection heat and a hyper-pneumatic module. Is equipped with an excess pressure chamber. Each heating zone – as well as zones integrated in the hyper-pneumatic chamber – has a tangential fan. Can also be operated without activating hyper-pneumatic chamber.
SEHO Systems, www.seho.de
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