Products
NXTP M35 printer supports panel sizes of 350 x 300mm. Is based on NXTP M25, but has a wider body for handling medium sized panels. Available in both single and double conveyor specifications; is for production of automotive and tablet panels. Features include vacuum for holding down the stencil during printing and snap-off, an adjustable squeegee angle, a low-impact clamping mechanism, and solder roll control to prevent air bubbles. Alignment accuracy is ±10µm, suitable for production of parts as small as 0402mm. Features touch-screen operation panel.
Fuji, http://smt.fuji.co.jp/e/
561-50 die attach adhesive attaches semiconductor die in temperature-sensitive devices. Is electrically conductive, and cures more than 90% cured after 30 min. at 80°C. Dispensing work life said to be greater than 48 hr. (measured as a 25% increase in viscosity). Exhibits damp heat resistance and conductivity stability. Fast cures at elevated temperatures (1 min.@180°C). For applications with high peel strength, smart cards, camera modules, flex circuits and other temperature-sensitive applications.
Engineered Materials Systems, www.conductives.com
SM481 chipshooter has a speed of 39,000 cph. Incorporates placement head with one gantry and 10 spindles with "flying" vision. Places 0402 chips through 42mm ICs. Electrically driven feeders, and compatible with SM series pneumatic feeders. Handles PCBs sized 460mm x 400mm through max. 740mm x 460mm max. Auto splicing and auto-loading.
Samsung, www.samsung-smt.com
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