Products
535-10M-1 UV cured adhesive is a low stress, lower glass transition temperature (Tg) version of 535-10M. Is nonconductive, and cures rapidly when exposed to high-intensity UV light. Features low outgassing. Contains no antimony. Is said to eliminate “crowning” (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in the head stack assembly. Can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
Engineered Material Systems, www.conductives.com
Insider 3 Long Tool combines 10 different screwdrivers into one lightweight, compact tool. The right bit installs into the magnetic holder in seconds for safe and simple use. Universal tool fits all standard 1/4" bits.
PB Swiss Tools, www.pbtools.us
Count on Tools, www.cotinc.com
PowerWave N2 reduces nitrogen and energy consumption. Is equipped with a closed, insulated, stainless steel tunnel system. Has hinged heat-resistant glass covers. Features fluxer unit that reduces flux consumption; has low maintenance requirements. Spray fluxer with HVLP technology reportedly ensures a stable spray jet and precise spray pattern, even at outer edges of the printed circuit board. Processed alcohol- and water-based fluxes. Flexible preheating zone configuration has active length of 1800mm; can be customized to specific production needs. May be equipped with infrared heating zones, immediately reacting quartz emitters, or convection heating modules. IR preheat zones ensure even heating of entire assembly; quartz heaters make for quick heat transfer and compensate temperature differences.
Seho Systems, www.seho.de
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