535-10M-1 UV cured adhesive is a low stress, lower glass transition temperature (Tg) version of 535-10M. Is nonconductive, and cures rapidly when exposed to high-intensity UV light. Features low outgassing. Contains no antimony. Is said to eliminate “crowning” (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in the head stack assembly. Can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

Engineered Material Systems, www.conductives.com

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