Macromelt MM6208 low-pressure molding material is for high thermal stability and chemical resistance. Has a 95°C relative temperature index rating; reportedly the highest RTI rating in its class. Uses an application pressure of between 20 and 500 psi. Is for certain automotive, consumer and appliance applications.
Henkel, www.henkel.com/electronics
Macromelt MM6208 low-pressure molding material is for high thermal stability and chemical resistance. Has a 95°C relative temperature index rating; reportedly the highest RTI rating in its class. Uses an application pressure of between 20 and 500 psi. Is for certain automotive, consumer and appliance applications.
Henkel, www.henkel.com/electronics
Board Merger enables automatic generation of a project database, while maintaining original signal designations and board characteristics. Debugging is facilitated and diagnostic information quality is reportedly improved. Handles each board as an individual object with bequeathing properties. Connections between single objects are initiated by referencing maintaining the original net designation. I/O modules can be inscribed into the principle as adapters. If modules of the same type are used, the whole process is handled through duplicating. Is integrated as standard in the System Cascon development package starting with version v. 4.6.
Goepel electronic, www.goepel.com