Products
SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature upon exposure to atmospheric moisture. It cures to form an elastic, flame retardant silicone rubber and exhibits primerless adhesion to many substrates.
Momentive Performance Materials, momentiveperformancematerials.com
A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.
Practical Components, www.practicalcomponents.com
A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.
Practical Components, www.practicalcomponents.com
Press Releases
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