Products
i-Cube series model YSH20 flip-chip placer features a high-rigidity frame and dual-mount heads; is fitted with a chip recognition system employing a high-res camera. Is compliant with a 12" wafer supply unit (optional). Is possible to achieve a mounting capability of 4,500 uph. Can handle a variety of chip types ranging in size from 0.3 to 18 mm. Two types of wafer ejectors come standard.
Yamaha Motor, www.yamaha-motor.com
Ledcheck VIII automatically tests color, wavelength and light intensity of LEDs on PCBs while under test on automatic test equipment. Each module can accommodate eight LEDs; modules can be cascaded for additional channels. Each channel measures the true color of the LED under test and provides an analog output to the test system proportional to the wavelength of the light detected from the LED. Using digital channel addressing, the channel selection is under control of the test system.
Everett Charles Technologies, www.ectinfo.com
MC-392, for high-mix assembly, has two heads and features a placement rate of 6,400 cph. Includes ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm, 3 Sigma. Comes as inline configuration with up to 96 feeders or as standalone unit with space for 160 feeders. Cognex-based vision system offers on-the-fly alignment of any SMD from 0.4 x 0.2 mm (01005) to 16 x 14 mm, including CSPs and µBGAs. Vision cameras align components up to 150 x 100 mm, including large BGAs and QFPs to 0.3 mm lead pitch. Selectively checks solder paste printing and component placement accuracy.
Manncorp, www.manncorp.com/pick-and-place/mc392
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