Products
MicroLine 1000 S depaneler features a UV laser beam for cutting along components or circuit paths, reportedly without mechanical or thermal interference. Is toolless, allowing any contour. Is programmable via included software or via the CAD software. Compact footprint.
LPKF, www.lpkf.de
Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.
Heraeus, www.wc-heraeus.de
Viscom, www.viscom.com
Press Releases
- KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
- ECIA Executive Conference Announces Session on eCrime Tradecraft
- ICZOOM Group Inc. Announced the Launch of PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
- Amtech Unveils Proprietary Automation Model for High-Mix, Low-Volume Manufacturing