Products
Cion ICT Adapter is a relay card for integration into fixture adapter systems for ICT. Enables switching of 32 test channels from the ICT to Scanflex. Prohibits a collision of both systems’ signals; minimizes dynamic effects because of multiple wiring at critical nets. Two LEDs indicate 5 V supply and activation state. Is available in different assembly variants: Relay Adapter SL is equipped with pin contact strips and suits bird nest wiring by wire wrap into adapter systems, as well as wiring a 50-pin ribbon cable, as used in DIO plug modules; Relay Adapter BU and Relay Adapter BU90 are single-sided, equipped with connector strips; enable direct pluggable connection to Cion Modules such as FXT96 in both horizontal and vertical directions. Can be used with plug-in card transceivers. Boundary scan TAP signals are switched with relay adapter similar to TIC02/SR modules. Switching 32 PIP signals is possible with one card.
Goepel electronic, www.goepel.com
S3X-BF70M and 200N series wafer bumping pastes exhibit a high definition over time at elevated temperatures. S3X-BF70M series is for 250 μm bump sizes. Offers superior cleaning performance in a SAC 305 powder with a 20~38 μm diameter. S3X-BF200M is for 100 μm bump sizes with a SAC 305 powder and 5~20 μm diameter.
Ko-ki, www.ko-ki.co.jp
i-Cube series model YSH20 flip-chip placer features a high-rigidity frame and dual-mount heads; is fitted with a chip recognition system employing a high-res camera. Is compliant with a 12" wafer supply unit (optional). Is possible to achieve a mounting capability of 4,500 uph. Can handle a variety of chip types ranging in size from 0.3 to 18 mm. Two types of wafer ejectors come standard.
Yamaha Motor, www.yamaha-motor.com
