Four-ply, peel-n-stick FPDSEM 90 cooling patch reduces chip and circuit temperature by as much as 11% without the need for a heatsink. Thermal material radiates heat from an electronic component to the surrounding environment. Apply patch like a sticker to the surface of any hot spot. Can be custom cut or trimmed to fit virtually any shape. Provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Is 25 mm thick and can be ordered in sheets, rolls or kiss-cut rolls.
Fujipoly America Corp., www.fujipoly.com
DM8000 M and DM12000 M are for 8" or 12" wafers, respectively. The integrated macro mode of the optical inspection microscopes reportedly provides up to 4x the field of view of conventional scanning objectives; entire scan area can be checked for possible defects. LED illumination is integrated in the stand. Optional i-line UV illumination is based on LED. Oblique UV mode combines oblique illumination with i-line UV light.
Leica Microsystems, www.leica-microsystems.com
Manual plungers and pistons for the 700 series syringe barrels provide dispensing solutions without the need for compressed air. Are molded from Polypropylene resin and compatible with a range of dispensing fluids. Are made from thermoplastic rubber and available dry or with lubrication. Are available in four sizes (three, five, 10 and 30 cc) and are packaged in boxes of 50 pieces.
Techcon Systems, www.techconsystems.com