Circuits Assembly Online Magazine - Current Issue

Products

PR1 BGA Solder Ball Checker is for inspection of BGA soldering and QFP lead sections. Provides inspection of soldered points and BGA surfaces; features a conductive body for ESD. Enables visual inspection of QFP leads and chip parts. The handheld tool is 50 x 30 x 15 mm. Weighs 25 g. Comes with a wrist strap. Is capable of inspecting the interior section of BGA packages using a battery-powered white LED lighting system. With an expanded lens, it is capable of up to 7X magnification.

Seika Machinery Inc., www.seikausa.com

SPC+ Software is a yield improvement tool for solder paste printing. Is a high-functionality statistical process control package that can be run on the system or offline. Analyzes images and data to track performance. Defect review, X Bars and S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated with Pareto charts and the ability to drill down on specific data points. Real-time capabilities permit immediate adjustment of solder paste printing parameters. Included free on all new Koh Young equipment.

Koh Young Technology, www.kohyoung.com

High-Throughput Flex Line includes twin MC-385 pick-and-place machines with a combined placement rate of 10,000 cph, each IPC-9850-rated at 5,500 cph, and capable of placing parts ranging from 0201 up to 150 mm x 100 mm. Includes MC-1400 automatic stencil printer, CR-8000 8-zone Pb-free reflow oven, and two conveyors to permit pre-reflow inspection.

Box Builder Line features MC-387 placer with 224-feeder capacity and IPC-9850-rated speed of 5,500 cph. Is for low-volume, high-mix runs. Can be programmed for multiple processing scenarios without changeovers and downtime. Line includes MC-1400 automatic stencil printer, CR-5000 5-zone Pb-free reflow oven and CT-90L inspection conveyor.

Manncorp, www.manncorp.com