Products
XPM3i reflow system has an enhanced atmosphere recirculation system said to deliver nitrogen savings of up to 50%. Can be equipped with dual-lane, dual-speed conveyor option for high-mix processing. Includes new software features. Is equipped with AUTOset fast setup; makes it possible to accelerate process development by generating a preliminary reflow recipe based on PCB assembly’s physical characteristics. Can fine-tune preliminary recipe if needed; 85% of the time, modifications are not needed.
Vitronics Soltec, www.vitronics-soltec.com
Space-Saver BNC connector mounts on the edge of a PCB. Provides low profile for applications with tight vertical constraints. Reduces twisting stress on solder joints inherent in BNC connector mating. A notch in the connector slips over PCB edge prior to soldering, forming a tight mechanical fit that transfers majority of rotational energy to the PCB instead of solder joints. Center pin and connector body are soldered directly to a PCB, minimizing antenna effect caused by elevated mounting approaches and associated EMI/RFI problems at higher frequency ranges. Has a 75 ohm impedance and is tested to 2 Ghz.
Regal Electronics Inc., www.regalusa.com
The Fine Silver Conductor Trial Kit is capable of producing fine silver conductor traces down to 50 µm for high-density thick film circuits. Can experiment with fine polymer thick film circuits and functional printable and flexible electronics without screen printing equipment. Includes screen mask with standard fine patterns, a printing table, 50 g special silver ink, flexible substrates, squeegee, and other materials. Working table and thermal oven required.
DKN Research, www.dknresearch.com
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