Products
No. 931 is an electrically heated, 1250°F high-temperature universal oven used for various heat treatments. Workspace dimensions measure 25" x 36" x 24". 18 kW are installed in Incoloy-sheathed tubular heating elements, while a 1000 CFM, 1-HP recirculating blower provides a universal front-to-rear airflow to the load. Features 10"-thick insulated walls, comprising 2" of 1900°F block and 8" of 10 lb/cf density rockwool insulation. Includes an aluminized steel exterior, Type 304 stainless steel interior, and a motor-operated vertical lift door controlled by a foot pedal. Includes digital indicating temperature controller, manual rest excess temperature controller with separate contactors, recirculating blower airflow safety switch, fused disconnect switch, and a 10' power cord.
The Grieve Corp., www.grievecorp.com
Q-BI58 is Pb-free solid wire for heat-sensitive assemblies. Is composed of 42% tin and 58% bismuth wire solder. Is a soldering alternative for heat-sensitive components that require a low melting point. Meets or exceeds J-STD-006 requirements and all other relevant standards. Sn42/Bi58 is sold per 500 g. box, and is available in a wide variety of diameters.
Qualitek International Inc., www.qualitek.com
Ablestik WBC-8901UV is for stacked die packages for the memory market, including TSOPs, MCPs and FMCs. Reportedly reduces total cost of ownership up to 50% compared to film. Can adjust die attach thickness based on specific manufacturing requirements; can select dicing tape of choice. Is applied via a spray coating method following wafer thinning process. Dicing tape is laminated to the wafer; backgrinding tape is removed, and the wafer is diced in preparation for die pickup and placement. Wafer coating of 10 µm, with a total thickness variation across the wafer of +/-10%, and material waste of less than 20% are possible.
Henkel, www.henkelna.com
Press Releases
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- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System