Q2119A fine-pitch, fine-wire (17-75µm), automatic gold ball bonder is for smaller lot sizes, multiple product variations and frequent setup changes. For prototypes to medium-volume production. Runs on Windows XP Pro; offers intuitive, menu-driven software, with access to all machine functions. Interface provides point-and-click bonding; unlimited wires; easy bond process editing; extensive program storage, and a bond parameter library. Options include programmable ultrasonic generator (256 increments) with low impedance transducers, programmable temperature controllers (optional dual-loop), application-specific software, and custom machines with tables up to 300 x 300 mm.

Questar Products International, www.questarproducts.com