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DSP866 is a no-clean, Pb-free, no-halogen solder paste. Is said to provide print definition characterized by brick-like prints. Good release is seen on 0.00" - 0.012" apertures with print speeds in the range of 1 - 6 in. per sec. Performs during continuous printing for up to 8 hr. Residues are said to be nonconductive, noncorrosive and highly insulated. Flux classification ROL0 per J-STD-004. Available in standard gray or patented green formula.

Qualitek International Inc., www.qualitek.com

An enhanced version of the interface between Pantheon layout software and Quantum Channel Designer and Quantum-SI products permits the determination of operating timing and voltage margins for high-speed interfaces. Along with Xtent high-speed design option, it provides a tool set for advanced signal integrity.

Signal Integrity Software Inc., www.sisoft.com
Intercept Technology Inc., www.intercept.com

 

The solder paste recycling unit enables approximately 90% of waste solder paste to recover as solder bar. Reduces CO2 emissions. Waste materials are mainly flux effluent, filter and waste cloth. Waste material is less than 1/10 the volume. Required time to recycle is approximately 35 to 45 minutes. Enables selection of manual or automatic mode using touchscreen panel. Max solder capacity per cycle is approx. 5.5 lbs.

Seika Machinery Inc., www.seikausa.com

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