Stamped Circuit Board thermal management draws heat away from beneath the chip quickly. Combines structured layers of metal and plastic for use in substrate assemblies. Is based on a reel-to-reel concept and offers possibilities to automate production. Possible solutions: with versatile stamping, materials can be inflected and stamped; the resulting shape stabilizes the substrate and fixates the lenses; open choice of many different materials and thicknesses; simpler operation, and quicker separation.

Heraeus, www.wc-heraeus.de

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