S2088BO-II automatic optical wirebond inspection desktop system is available. Was developed to inspect medium and small product runs, delivering defect detection on die, ball-wedge, wedge-wedge and security bonds. Reportedly guarantees reliable defect detection to cover typical bonds. During inspection, a high-res camera records all bond sites and wires. Inspects aluminum thick wire and aluminum, or gold thin wire connections, down to diameters of 17 μm. Inspection library includes inspection patterns for damaged and misplaced components. Is 100 % compatible with all Viscom inline systems; can be employed as a programming station.

Viscom, www.viscom.com

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