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Products

The 4000Plus multi-purpose bondtester is able to perform a wide range of shear and pull applications, as well as push functionality up to 50 kg. Is suitable for traditional bond tests, and meets the requirements of ribbon pull, hot bump pull and fatigue. Has anti-backlash system to aid the setting and control of step back. Is available with a range of XY stages, with a 160 mm XY stage as standard, and an image capture system. Has extended working envelope of 200 mm for testing oversize parts. Uses Paragon software.

Nordson Dage, www.nordsondage.com

PR1 BGA Solder Ball Checker is for inspection of BGA soldering and QFP lead sections. Provides inspection of soldered points and BGA surfaces; features a conductive body for ESD. Enables visual inspection of QFP leads and chip parts. The handheld tool is 50 x 30 x 15 mm. Weighs 25 g. Comes with a wrist strap. Is capable of inspecting the interior section of BGA packages using a battery-powered white LED lighting system. With an expanded lens, it is capable of up to 7X magnification.

Seika Machinery Inc., www.seikausa.com

SPC+ Software is a yield improvement tool for solder paste printing. Is a high-functionality statistical process control package that can be run on the system or offline. Analyzes images and data to track performance. Defect review, X Bars and S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated with Pareto charts and the ability to drill down on specific data points. Real-time capabilities permit immediate adjustment of solder paste printing parameters. Included free on all new Koh Young equipment.

Koh Young Technology, www.kohyoung.com