Products
ProFlow ATx enclosed head printing technology can accommodate all solder pastes. Combines a low-volume print chamber with a paste loading mechanism. Actively conditions solder paste materials; delivers a paste roll for precise aperture filling. Has direct, automatic loading from packaging. Reportedly meets criteria of first pass yield of better than 98% and scrap of less than 0.5%.
DEK, www.dek.com
DEK, www.dek.com
Q Series 600 mL cartridges have leak-free mixer connections and standard side-by-side outlets. Are currently available in 600 mL, 1:1 ratio cartridges. Are easy to open and close; fit common industry dispensers; are pressure-tested and sturdy. Are available in polypropylene or nylon. Have an optional flow restrictor for low viscosity materials.
Sulzer Mixpac USA Inc., www.sulzermixpacusa.com
Multicore LF620 is a no-clean, halide-free, Pb-free solder paste that has a broad process window for printing, reflow and humidity resistance. Has a consistent print performance with minimal hot slump, even with temperatures of 86°F or more and relative humidity of 80%. Exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes, including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Has good printability at low or high speeds. Is well suited for the automotive sector. Delivers a high tack force for component stability during high-speed placement, an abandon time of four hours and a print work-life of up to 24 hours.
Henkel, www.henkel.com/electronics
Henkel, www.henkel.com/electronics
Press Releases
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System