Circuits Assembly Online Magazine - Current Issue

Products

A-108 aluminum paste is printed as a back electrode on single or polycrystalline silicon solar cells. A-568 Pb-free silver front-side paste is used for back contact on silicon solar cells. A-368 high-conductivity back-surface paste adheres to aluminum. All are metallization pastes for photovoltaic cell manufacturing.

Giga Solar Materials Corp., http://www.gigasolar.com.tw/english.asp

Automated Optical Inspection (AOI) Report is an analysis of AOI offerings including price/performance benchmarks, supplier perception ratings and a direct comparison of 44 performance metrics for 27 unique models offered by 11 different AOI suppliers. Examines market dynamics for solder paste and PCB inspection. Analysis includes end-user inspection requirements, served and not served prerequisites and emerging technologies. AOI suppliers described in the report include ASC International, Agilent, Christopher Associates, CyberOptics, DJK Global, Goepel, GSI Lumonics, Koh Young, Landrex, Malcomtech, Marantz, Mirtec, MVP, Omron, Opto Control, Orbotech, Panasonic, Qualectron, Saki, Seika, Sony, Viscom, ViTechnology and YesTech. 50 pp.

ITM Marketing, www.itmconsulting.org

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.

S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.

Koki Co. Ltd., www.ko-ki.co.jp