Circuits Assembly Online Magazine - Current Issue

Products

The IS-450 selective soldering machine automatically solders through-hole components onto mixed technology PCBs using an under-board mini-wave; solders connectors, capacitors and high-power devices onto boards at Pb-free process temperatures of 250º to 330ºC. Conducts dip-and-drag selective soldering for post-reflow, through-hole components and odd forms. Is powered by closed-loop servo motors for X, Y & Z axis motion that articulate the fluxer and mini-wave. Maintains adjustable clearance of as little as 1.5 mm. Reportedly solders from 3X to 8X more quickly, and with higher accuracy, than hand soldering. Is programmable off-line to govern wave temperature and height, travel speed and dwell time at each point.

Manncorp, www.manncorp.com

Vectra G Series includes two halogen-free liquid crystal polymer grades with processing characteristics that avoid issues commonly encountered when using flame-retardant, high temperature nylons to mold components. Vectra G131 and G331 are LCPs designed to help meet Pb-free soldering and halogen-free requirements. Vectra G131 is 35% glass-filled; Vectra G331 is 35% mineral- and glass-filled. Both are flame resistant without additives; V-0 to 0.15 mm; potential drop-in solutions for small FR, HT nylon parts. Said to achieve dimensional stability in thin-wall parts at more than 260°C. Processing advantages reportedly include fast molding cycle; no flash and mold deposit; Pb-free reflow capable; no moisture-related blister issues; longer tool life (noncorrosive in water-heated molds).

Ticona Engineering Polymers, www.ticona.com

IPC-A-610E, Acceptability of Electronic Assemblies, provides visual acceptance criteria for post-assembly mechanical and soldering assembly requirements. Now addresses additional technologies, including flexible circuits, board-in-board, package-on-package, depanelization and additional SMT terminations. Photos and drawings showing good and bad connections have been updated. Contains 165 new or updated illustrations (800 total). Sections have been reorganized so data and images are easier to find and use. Changes that have occurred in array packaging since the standard’s last revision are also addressed, as are changes to hot tear and filet lifting.

IPC, www.ipc.org