Kaleido high-resolution color head enhances definition at the repair station; enabling decisions based on the defect picture. Inspects solder joint and lead defects. With i-lite technology, a color-enhancement solution at the defect viewer station is offered; can see 01005 components, as well as associated solder joint. RGB lighting structure enables rendering of color picture.
Vi Technology, www.vitechnology.com
EP30BN is a two-part boron nitride epoxy adhesive; is a medium-viscosity epoxy with good flow characteristics for bonding, sealing and potting. Is designed to optimize heat dissipation, and cures at room temperature. Mechanical strength properties and chemical resistance are maintained over the temperature range of -60° to 300°F. Has volume resistivity in excess of 1014 ohm cm and thermal conductivity of 24 btu/hr/ft2/°F/in.
Master Bond, www.masterbond.com
Multicore TFN700B is a no-clean, halide-free tacky flux formulated specifically for package-on-package applications. Is a Newtonian-based system; reportedly eliminates shearing conditions associated with traditional tacky flux formulations. Enables optical recognition of flux by pick-and-place systems; permits visual verification of volume before placement of the top component of the PoP. Is suitable for doctor blading and dip transfer for PoP builds. Is ROLO-classified, or non-hydroscopic and non-corrosive.
Henkel Corp., www.henkel.com/electronics