Circuits Assembly Online Magazine - Current Issue

Products

TF series Teflon lined tips are for low viscosity fluids and Cyanoacrylates (super glue) material. Reportedly resists Cyanoacrylate clogging and prevents substrate. Features a double helix Polypropylene color hub and a rigid Teflon crimped lining that projects approximately 1/8" from the inside of a stainless steel tube. Are compatible with a range of fluids and composed of silicone-free materials. Are rated industrial grade safe up to 100 psi and are conveniently available in both bulk quantity and packs of 50 pieces.

Techcon Systems, www.techconsystems.com

The Precisioncoat spray and dispense system now has programmable tilt and rotate, needle calibration and a vision system. The programmable tilt and rotate functionality provides 5 axes to coat alongside and underneath components. Is said to have precise movement along the x, y and z axes; offers programmable tilt up to ± 60° and 360° rotation in 1° increments. Needle calibration is designed to verify the needle is in the correct position. If the needle is offset, the program will adjust accordingly. Uses fiducial or pattern recognition to identify the location of the board to be coated.

Specialty Coating Systems, www.scscoatings.com

Siplace CA die bonder and SMD placement machine is based on the Siplace X-series platform and processes dies (flip chip and die attach) directly from a wafer, while it can also place conventional SMT components. Reportedly processes up to 36,000 flip-chip components per hour, and can bonds up 36,000 dies per hour at an accuracy of up to 10 µm at 3 sigma. In SMT mode, it reportedly places up to 90,000 cph with an accuracy of 41 µm at 3 sigma. Processes dies from 0.8 to 18.7 mm2 (expanded die bandwidth upon request). Maximum wafer size is 12".

Siemens Electronics Assembly Systems, www.siplace.com