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MAP v. 2.17a thermal profiling software permits programming the number of degrees within the peak temperature on any channel, and measuring the time during which the channel was above that temperature. Defines the amount of time (within 5°C) of peak a particular component can withstand without damage. Permits optional alignment of profile channel data using board placement physical dimensions and conveyor speed, reducing the lag time in retrieving information from the back of the board. Is said to predict (within 1 to 2 °C) the board temperatures by adjusting the bottom zone temperature in addition to the traditional top zone adjustment.

 ECD, www.ecd.com

 

MS151 two-part silicone optical adhesive has a reported refractive index of 1.43 and is for optical potting, casting and encapsulation. Cures at room temperature; is said to provide electrical insulation and resistance to vibration, impact, shock and thermal cycling. Shrinkage on cure is less than 0.1%. Dielectric strength is 460 V/mil and volume resistivity is 1x10E15 ohm-cm. Exhibits elongation-at-break of 160%. Operating temperature range is -65° to +400°F (-64° to 205°C).
 
Master Bond, www.masterbond.com

Sarcon GR-H and XR-H thermal interface gap pads are said to simplify board-level maintenance by reducing material tearing during disassembly for rework and repair. Are manufactured with a hardened top surface. One-sided surface treatment is less tacky than the opposing contact side, permitting the thermal pad to consistently adhere to the electrical component or opposing heat sink. Release from component without tearing or damage. Are available in eight different formulations; offer thermal conductivity from 1.2 to 17.0W/m°K. Sarcon Hardened Surface conforms to uneven components. Gap fillers are available in sheets with thicknesses from 0.5 to 5.0 mm to 200 x 300 mm.
 
Fujipoly America Corporation, www.fujipoly.com

 

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