Circuits Assembly Online Magazine - Current Issue

Products

Master Bond MB514 polypropylene adhesive etches at bonding challenges presented by non-polar and low-energy polyolefin surfaces. The polyolefin-based hot melt is said to be suited for use on untreated surfaces of polyethylene, polypropylene and combinations. Excellent bond performance is said to be retained over a temperature range of -20°F to 190°F. Is VOC-free; is comprised of 100% solids and contains no solvents. Does not require clamps or post cure during assembly. Is reportedly ideal for high-speed assembly operations.

Master Bond, www.masterbond.com

FH12 series FPC/FFC connectors are available with contact pitches of 0.5 and 1.0 mm. ‘Half tuning fork’ contacts maintain standard force without relying on connector housing. Flip-lock actuator is said to eliminate the need for a side latch, permitting placement of two or more connectors side by side; requires 6.9N of force to lock; has a mounted PC board height of 2.0 mm. Available in top or bottom contact point configurations and horizontal or vertical mount styles. Use 0.3-mm thick FPC/FFC. One version can use 0.18-mm thick FPC. Insulation resistance is 500MΩ at 100VDC, with a maximum contact resistance of 50mΩ at 1mA. Current rating is 0.5A DC, with a voltage rating of 50V AC. Operating temperature ranges from -40°C to +70°C.

Hirose Electric, www.hiroseusa.com

Work In Process software is based on barcode technology. Is for tracking who is assigned a job, where it is in the plant, and how long it has been in that location. Work order can be tracked to department, task or employee; multiple jobs many be assigned to the Badge, and timeframes may be set for each task and reported when overdue. Is said to reduce late jobs and identify bottlenecks.

Dynamic Systems Inc., www.click2barcode.com