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HTCX and HTCPX thermal management solutions are enhanced versions of HTC and HTCP. Feature improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. Have been specially formulated by using a proprietary additive to provide a significant increase in thermal conductivity without sacrificing viscosity, consistency or film thicknesses. HTCPX uses various metal oxide (ceramic) powders; reportedly ensure leakage currents cannot be formed if the paste should come into contact with other parts of the assembly. Both contain no silicones and cannot migrate onto electrical contacts.

Electrolube, www.electrolube.com

Rapid Prototyping Services are designed to support the need for faster validation of IC and package designs and speed the transition to full production. Specifically developed to address prototype speed, offering a path to rapidly validate ASIC designs by providing access to advanced interconnect capabilities. Within the medical, communications, defense and measurement markets, three services levels were identified for rapid prototyping-BGA build-to-print, advanced build-to-print and process evaluation build. Entry-level prototyping is offered via BGA build-to-print, assembling JEDEC-standard BGAs in as little as three business days.

Maxtek Components Corporation, www.maxtek.com

RED-E-SET is an installed automatic board center support for pick-and-place machines. Features include manual or automatic lock, improved quality, and reduced changeover time. Is said to be easy to install and remove in the machine; strips can be added as needed. Supports a range of board widths, as well as support lengths up to 24".
 
Production Solutions Inc., www.production-solutions.com

 

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