Products
Multicore TFN700B is a no-clean, halide-free tacky flux formulated specifically for package-on-package applications. Is a Newtonian-based system; reportedly eliminates shearing conditions associated with traditional tacky flux formulations. Enables optical recognition of flux by pick-and-place systems; permits visual verification of volume before placement of the top component of the PoP. Is suitable for doctor blading and dip transfer for PoP builds. Is ROLO-classified, or non-hydroscopic and non-corrosive.
Henkel Corp., www.henkel.com/electronics
Spectrum thermal process optimization software is said to automatically identify the correct furnace setup for a thermal profile within the sweet spot of the established process window. Uses information from a single profile pass to evaluate millions of possible furnace setups. Each possible furnace recipe will yield a profile, and the Spectrum identifies the fit between the profile and the established process window. Within seconds, reportedly can complete an exhaustive ranking and present its recommendation for the furnace recipe (zone temperatures and conveyor speed). Is a software-only option for the SunKIC profiler.
KIC, www.kicthermal.com
e-Clipse is said to be fast and convenient to attach, and provides repeatable profile readings. Features four spring-loaded thermocouples within a lightweight fixture that also holds the solar wafer. TCs have disk-shaped beads, rather than the traditional spherical shaped beads, for reliable contact to the solar wafer surface. Permits quick replacement of broken wafers. Four standard type K TC connectors plug into the profiler.
KIC, kicthermal.com
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