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Dross-B-Gone powder separates dross from molten solder. Applicable for wave soldering and other processes involving considerable volumes of solder. Is claimed to recover in several minutes almost 90% of the pure solder originally used. Is effective with both Pb-free and SnPb solders. Eliminates dross by quickly oxidizing it into an easily removable powder that is discarded, while pure molten solder remains in the pot and becomes reusable. Is sprinkled on the molten solder at an approx. ratio of 10 g per 1000 g of solder dross. The pure solder recovery rate is 880 g.
 
Manncorp, www.manncorp.com/wave-solder/dross-b-gone/.

 

ZelFlex Protect is a reusable stencil frame system that is an alternative to glued stencil frames. Stencil foil can be stored as a flat sheet if not in use. Can stay on the stencil to permit safe handling and quick changeover. Changing a stencil is said to take 30 sec. or less. Comes in industry standard form factors and reportedly is compatible with virtually any stencil printer. Outer dimension is 23" x 23" and total thickness is 1".
 
LPKF Laser & Electronics, www.lpkfusa.com
 

 

The Modular Compact platform consists of MC-12, MC-1 and MC-8. Packs up to 126 ultra-thin (12-mm) feeders into each machine. A side-view camera prevents placement defects. Has full-featured graphical programming tools and common family setups and production scheduling. Incorporates intelligent and lightweight feeders that reportedly can be changed in seconds. Includes offline preparation, online loading units and Feeder Exchange Systems. Standard equipped with tape cutting. MC-12 has vision recognition that uses a moving side-view scan camera with advanced optics; simultaneously takes X and Y component measurements; helps prevent misplaced or missing components, and rejects components with bent leads, damaged bumps or that have been picked upside down. A chipshooter places up to 36,000 cph with 50µm accuracy at 3 sigma. With up to 120 feeder positions, space productivity is 20,000 cph/m2. MC-1 multifunctional mounter (19,100 cph and 126 feeder positions) and MC-8 fine-pitch mounter (8,900 cph and 119 feeder positions) both have 30 µm accuracy. All have automatic nozzle cleaning procedures. Platform accepts component range from 0.4 x 0.2 mm up to 100 x 45 mm, or 55 x 55 mm with component heights up to 25.5 mm, and programmable placement forces from 10 to 30N for press-fitting complex components. Accepts boards up to 510 x 460 mm. On-board tools enable teaching of placement locations, fiducials and component shapes.
 
Assembléon, www.assembleon.com

 

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