Products
ZIP contacts for semiconductor test feature planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs.
Everett Charles Technologies, www.ectinfo.com
ProLINE-RoadRunner XLF inline automated programmer programs flash memory and microcontroller devices using FlashCORE II. Extra large format supports device sizes up to 32 mm sq. and tape widths of 32 mm and 44 mm. Can be reconfigured to support small- to medium-sized devices in tape widths of 16 mm and 24 mm. Features automatic supply application software. Initially available exclusively for Siemens assembly machines.
Data I/O Corp., www.dataio.com
Data I/O Corp., www.dataio.com
The upgraded YTV F1 Series AOI inspects solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is said to be for high-volume or high-mix manufacturing environments; also for pre/post-reflow applications. Has four oblique viewing cameras; offers inspection for R-nets. Improved Fusion lighting, with multi-color solder joint inspection, reportedly delivers 20% higher detection capabilities compared to previous models. Offers offline programming and a standard package library. Real-time SPC monitoring is standard.
YESTech Inc., www.yestechinc.com
YESTech Inc., www.yestechinc.com
Press Releases
- TT Electronics AnnouncesCEO Appointment
- Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium in Niskayuna, NY
- Clemsa Achieves up to 75% Faster Changeovers and Higher Quality with Europlacer SMT placement line
- Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan