Circuits Assembly Online Magazine - Current Issue

Products

The Unicon 108XL high-power soldering iron is for high mass soldering applications, including printed circuit assembly, industrial and solar cell manufacturing. Is available in 150 and 300 W versions. Uses a high mass soldering tip. Features are said to include precision control, fast recovery time, and the ability to use solder wire up to 2 mm diameter.

Christopher Associates, www.christopherweb.com

LPKF Stencil Laser P 6060, for SMT stencils production, is fully enclosed. Uses a lightweight motion system said to permit excellent positioning accuracy, while maintaining high cutting speeds. Can cut all stencils, both framed and frameless; can be adjusted to fit any stencil size up to 29.1" x 37.4". Requires minimum setup. Features a fiducial camera for automatic reload. Can cut with compressed air and oxygen. Can be remotely serviced via Internet.

LPKF Laser & Electronics, http://www.lpkfusa.com

The RO06-PLUS batch oven offers Pb-free soldering capability and curing programs with durations up to 18 hrs. Features integrated microprocessor control and fully automatic processing. Applications include prototyping, small batch manufacturing and testing. Integrated microprocessor control provides a large set of predefined soldering and curing programs. Includes free memory for other temperature profiles; temperatures up to 300°C can be stored. Large-view window permits observation. Has process pausing function. Process can be extended manually. Can measure temperatures directly on the processed materials by thermocouples. Zone and material temperatures are shown on LCD or transmitted via an RS232 interface to external software. Consists of two process zones: a sealed heat chamber and an open cooling section. A motorized drawer drives the substrates between the two zones. Hot process chamber includes a full convection heating system.

Essemtec USA, www.essemtec-usa.com