Sarcon XR-Pe is a putty-like thermal interface material. Is said to help improve semiconductor performance by transferring unwanted heat to a nearby heat sink. Is silicone-based and conforms to most CPU and semiconductor shapes with a low compression force requirement. Is maintained for applications that require up to 90% material compression. Reportedly offers thermal conductivity of 11 watt/m-k with a broad operating temperature from -60°C to +200°C. Is available in 2.0 or 1.5-mm thick sheets up to a maximum dimension of 300 mm x 200 mm. Can be ordered in die-cut form.
Manual Tip-Seal Kiss dispense valve is said to be ideal for dispensing low- to high-viscosity one-component adhesive and sealant materials such as silicone or polyurethane. Is used in repetitive fluid dispensing applications. Pistol grip assembly has an electric trigger with a guard and foam grip. Can be set to close valve for visual dispensing or automatically close the Tip-Seal valve for precision-metered volume of material. Is said to be ideal for dispensing solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Has carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals.
AlSiC (Aluminum Silicon Carbide) is a metal matrix composite packaging solution for traditional hermetic packaging applications. Is said to have a lower density value – 1/5 to 1/6 lighter in weight than CuMo and CuW, respectively – yet similar thermal conductivity and expansion coefficient. Designs reportedly are cast to the final shape, requiring no secondary machining. Net-shape casting capability enables direct creation of functional design features, such as pockets for circulators and cavities or pedestals for the die. A hermetic package assembled with an AlSiC base brazed to an alloy 48 frame is hermetic to better than 10-9 atm-cm3/s. Is RoHS compliant.