XF3 Pb-free solder paste accommodates extended reflow profiles without the use of nitrogen and is based on the patented SN100C alloy. Reportedly wets well to all common metal surfaces. Prints at 150-200 mm/sec, and reduces voiding.\
CAM350 Release 10 PCB verification and optimization software integrates with the Blueprint document authoring tool. Reportedly creates and distributes deliverables required for a complete PCB fabrication and assembly release package in one electronic file. The electronic release package can be used to distribute, view and extract documents, Gerber files, NC drill/mill data and panel designs. Includes a redesigned user interface. Other features include a universal release package navigator; a project explorer bar; a flip panel; design compare; crossprobing to Mentor Graphics Expedition; longer file and net name support; netlist and streams enhancements; PADS interface and usability updates, and defect fixes.
T200A is a batch-type Pb-free reflow oven for low volumes and limited floor space. Is said to be capable of attaining Pb-free temperatures to 300ºC; offers a ∆T performance envelope of ±1 ºC across a 360 mm x 230 mm processing area. Uses a mix of quartz IR and hot air convection. Solders chips and other SM devices in accordance with recommended profiles. Generates and stores 20 to 40 sequential time and temperature settings. Can be used for curing and drying.