Products
The KISS line of selective soldering equipment now includes a wave height monitor and control module. Reportedly maintains solder wave heights to within +/- 0.005". Is said to be effective when working with the wave nozzle sizes from 6 mm to 1.5 mm, and selectively soldering tight pitch component areas. Monitoring methodology incorporates resistive measurements of wave height relative to a known reference. Is performed at programmable intervals during extended production runs; closed-loop feedback is then used to automatically adjust solder pump speeds.
ACE Production Technologies Inc., www.ace-protech.com
ACE Production Technologies Inc., www.ace-protech.com
Cover-Extend Technology is a limited access solution for in-circuit test. Is said to eliminate the need for physical test points. Is part of VTEP v2.0 Powered test suite. Is a hybrid between Boundary Scan and VTEP Vectorless Test. Relies on stimulus provided by Boundary Scan cells. Benefits reportedly include improved test coverage (up to 50% node access); savings on fixturing, and strain relief on solder joints.
Agilent Technologies Inc., www.agilent.com
Agilent Technologies Inc., www.agilent.com
RTV 800 Series UV/Dual (UV/moisture) cure materials, for encapsulating and staking sensitive components, have reported cure speeds of fewer than three seconds. Patented chemistry permits paste-like products to cure up to 5/8" thick with minimal energy requirements. Viscosity of encapsulant ranges from a few hundred centipoises (for spraying and dip coating) to several thousand for thick coating and deeper potting applications up to 3/8" thick. Are self-leveling and flowable, and shadow cure at room temperature. Are based on silicone chemistry, translucent, and do not degrade or yellow on long-term exposure to light.
Novagard Solutions, www.novagardsolutions.com
Novagard Solutions, www.novagardsolutions.com
