Products
Siplace X4i placement machine is said to have a speed rating of 102,000 cph per IPC-9850, and a maximum theoretical performance rating of 135,500 cph. Features a dual conveyor, in which each of the two heads populates one board independently of the other, shortening travel between feeders and PCB. A third transport track moves PCBs through the machine to be processed in parallel on another machine. Another feature pushes two boards together on a single track and processes them as a single board.
Siemens, www.siplace.com
Indium8.9 no-clean Pb-free solder paste reflows in air and is said to be probe testable, low voiding at via-in-pad and in BGAs/CSPs, and easy to print and wet. Formulated to produce consistent print volumes even through stencil apertures below 0.66 ratios. Voiding reportedly in 5% range over many profiles when soldering BGAs with via-in-pad.
Indium Corp. of America, www.indium.com
PowerstrateXtreme Dispensable (PSX-D) is a phase change material that is said to offer many advantages of thermal greases. Remains solid at room temperature; becomes liquid when exposed to heat. Wets surfaces and fills surface irregularities with thermally conductive particulates. Thickness can be adjusted depending on the requirement. Can be stenciled, needle-dispensed, screen-printed or manually applied onto a heat sink or other surfaces. Cures and dries into a solid phase change material. Can be used as a TIM2 material for between microprocessors, IGBT, FBDIMM/Memory, GPU, MCMs, ASICs and active heatsinks. Is reworkable and repeatable.
Henkel, www.henkel.com/electronics
Henkel, www.henkel.com/electronics
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