Products
LFM 48 N is a no-clean, Pb-free alternative to gel pastes traditionally used in BGA PoP stacked device applications. Is for holding larger area devices that often exhibit warpage during reflow. Combines ultra-fine solder spheres and a low-voiding, thermally stable flux vehicle. Formulation comprises SAC 305 with a solder powder size of 4 to 24 µm. Features reported open time in a dipping tray 8 hrs. at 23°C and 50% RH, and up to 8 hrs. process window time between dipping and reflow.
Almit Ltd., www.almit.com
Almit Ltd., www.almit.com
The Horizon 01i screen printer now has a reported accuracy of 2.0 Cpk @ +/-25 µm, and can output DPMO statistics. The Horizon 03i now comes with Cyclone understencil cleaning, said to reduce changeover times and paper volume. And the Horizon platform range now comes with HawkEye post-print verification, said to verify 100% of boards in line beat rates (acquisition speeds: 750 to 1700 sq. mm per sec.).
DEK, www.dek.com
Lites Wipes are a generic version of Kimberly Clark’s Kimwipes. Reportedly are exactly the same but at a lower cost. Are made with absorbent low linting cellulose. Two sizes are available: 4.5" x 8.3" in 300/box quantities; 15" x 16.6" in 140/box quantities. Push-up dispensers are also available.
High-Tech Conversions Inc., www.high-techconversions.com
Press Releases
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System